R&D Module Engineer

About Xintec

"Xintec is the first package house which commercialized wafer level chip scale packaging (WLCSP). We prides ourselves a professional supplier of advanced packaging solutions with core values of Integrity, Innovation and Customer orientation. Started from Wafer Level CMOS image sensor packages, Xintec has expanded services across various sensor package services over optical, MEMS and customized wafer lever structure which can be utilized in consumer, communication, computer, industrial and automotive categories."

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